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Guide to Our Services - Corfin

Please visit the Navy ManTech Web site: www.navymantech.com 9 Period of Performance Jan. 2004 to Jan. 2005 Platform PEO (Ships) PEO (Carriers) PEO (Subs)

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Text of Guide to Our Services - Corfin

7-B RAYMOND AVENUE SALEM, NEW HAMPSHIRE 03079 USA +1 (603) 893-9900 Hot Solder Dip (RHSD)Tin Whisker Mitigation US Navy-qualified process removes 100% of the pure tin and replaces it with SnPb (tin-lead). Gold Mitigation Removes gold and replaces it with SnPb. Typically required to cover the effective seating plane. RoHS Compliance Removes the SnPb and replaces it with SAC305 (tin silver copper) or any other specified alloy. TestX-Ray Fluorescence Analysis (XRF) Used to determine lead (Pb) content of termination finishes and plating thickness. Fine and Gross Leak Testing Also referred to as Seal Test, these tests verify that the hermetic seal of a component is intact and typically follows Trim and Form and/or RHSD of a glass-sealed device. Solderability Testing Verify termination finishes will readily accept solder during assembly using J-STD-002 test or other military specification. Cleanliness Testing Determines ionic contamination on the part that can cause current leakage between and RepairBGA Reballing for Conversion to Tin-Lead or RoHS-Compliance Flushes all balls and alloy residue on the pads and replaces balls of Sn63Pb37, SAC305, or any other specified alloy. Trim and Form Forms and trims straight leads for surface mount placement per the customer s drawing or Corfin Industries can propose a drawing. An RHSD process typically follows this process to coat leads and prevent oxidization. Re-Conditioning of Bent Leads Robotic process realigns leads that are bent and scans to verify results. Lead-Attach to Leadless Chip Carriers Reduce solder joint stress by attaching J-shape and L-shape leads to LCC s using thermocompression SupportTape and Reel Components can be placed on Tape and Reel in the quantities desired for issue to the production floor. Kitting Components are placed in quantities and packaging that are process-friendly. Kitting is usually in conjunction with trim and form and/or RHSD services, but is also offered for hardware (nuts and bolts, etc.) Kits can be inventoried at Corfin Industries and partial quantities shipped per schedule or request from the customer. Guide to Our ServicesThe Worldwide Leader in Component Preparation ServicesPlease visit the Navy ManTech Web site: of PerformanceJan. 2004 to Jan. 2005PlatformPEO (Ships)PEO (Carriers)PEO (Subs)PEO (T)J-UCAS REPTECHBusiness EnterpriseOtherStakeholderPEO (IWS)Performing ActivityBMPCOEPoint of ContactDr . Anne Marie SuPrise(301) ManTech Investment$1,000,000Robotic Solder Dip Solves Tin WhiskerProblemS1057 - Tin Whisker MitigationObjectiveThe rapid rise of a worldwide lead-free movement driven by strong legislativeand market forces is causing manufacturers to rid their products of lead. As aresult, many electronic component manufacturers are transitioning from tin-lead surface finishes to pure tin. Pure tin components are known to cause tinwhiskers. Tin whiskers are electrically conductive hair-like filaments of pure tinthat grow over time, often in large quantities, from any type of hardware thathas been coated with a pure tin finish. Tin whiskers have been responsible formany electrical shorting failures, with an estimated loss of at least a billion dollarsworth of satellites, missiles, and other electronic controlled solder pot dips have been shown to successfully replacepure tin plating with a tin-lead solder coat on 100% of a component s lead surfaceson selected components. It was not well understood which types of componentpackages could be successfully 100% solder pot dipped without collateraldamage to their reliability from thermal shock. This ManTech project specificallyaddressed this project has successfully provided aqualification of the robotic solder dipprocess on a variety of electronicpackaging designs. It has identified whichtypes of tin-plated component packagescan be successfully solder pot dipped toremove all the tin plate and still meetmilitary reliability requirements. Theprocess will allow many programs to avoidcostly redesigns and production project report will provide users with the detailed information needed toemploy the qualified process in their programs for the part types successfullytested, should they so choose. A number of companies provide robotic solderdipping services. It would the responsibility of an individual program to verify thata solder dip vendor is capable of meeting the process requirements. A separatecommercialization experiment, funded and conducted by an industry participant,is piloting the creation of a niche industry that would allow their programs topurchase tin-plated components from a parts distributor, have them routed totheir qualified solder dip vendor for dipping and then delivered directly to theprogram as tin-lead finished visit the Navy ManTech Web site: of PerformanceJan. 2004 to Jan. 2005PlatformPEO (Ships)PEO (Carriers)PEO (Subs)PEO (T)J-UCAS REPTECHBusiness EnterpriseOtherStakeholderPEO (IWS)Performing ActivityBMPCOEPoint of ContactDr . Anne Marie SuPrise(301) ManTech Investment$1,000,000Robotic Solder Dip Solves Tin WhiskerProblemS1057 - Tin Whisker MitigationObjectiveThe rapid rise of a worldwide lead-free movement driven by strong legislativeand market forces is causing manufacturers to rid their products of lead. As aresult, many electronic component manufacturers are transitioning from tin-lead surface finishes to pure tin. Pure tin components are known to cause tinwhiskers. Tin whiskers are electrically conductive hair-like filaments of pure tinthat grow over time, often in large quantities, from any type of hardware thathas been coated with a pure tin finish. Tin whiskers have been responsible formany electrical shorting failures, with an estimated loss of at least a billion dollarsworth of satellites, missiles, and other electronic controlled solder pot dips have been shown to successfully replacepure tin plating with a tin-lead solder coat on 100% of a component s lead surfaceson selected components. It was not well understood which types of componentpackages could be successfully 100% solder pot dipped without collateraldamage to their reliability from thermal shock. This ManTech project specificallyaddressed this project has successfully provided aqualification of the robotic solder dipprocess on a variety of electronicpackaging designs. It has identified whichtypes of tin-plated component packagescan be successfully solder pot dipped toremove all the tin plate and still meetmilitary reliability requirements. Theprocess will allow many programs to avoidcostly redesigns and production project report will provide users with the detailed information needed toemploy the qualified process in their programs for the part types successfullytested, should they so choose. A number of companies provide robotic solderdipping services. It would the responsibility of an individual program to verify thata solder dip vendor is capable of meeting the process requirements. A separatecommercialization experiment, funded and conducted by an industry participant,is piloting the creation of a niche industry that would allow their programs topurchase tin-plated components from a parts distributor, have them routed totheir qualified solder dip vendor for dipping and then delivered directly to theprogram as tin-lead finished Industries LLC7B Raymond AvenueSalem, NH 03079 for this US NAVY ManTech Project provided by:

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