Example: barber

Flip Chip Ball Grid Array Package Reference Guide …

SPRU811 Flip Chip Ball Grid Array Package 7 ˇˆ 1 Abstract Texas Instruments (TI ) Flip Chip Ball Grid Array (BGA) packages provide the design flexibility to incorporate higher signal density and overall IC

Tags:

  Guide, Reference, Design, Texas, Ball, Texas instruments, Instruments, Package, Array, Grid, Ball grid array package reference guide, Grid array

Information

Domain:

Source:

Link to this page:

Please notify us if you found a problem with this document:

Other abuse

Related search queries